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MEMORY CHIPS - BOC & FBGA

MEMORY CHIPS

A flash memory chip is an electronic non-volatile computer storage medium that can be electrically erased and reprogrammed. The flash memory chip is a close relative to the EPPROM (electrically erasable programmable read-only memory), but it differs in that it can only erase one block at a time. It is a solid-state chip that maintains stored data without any external power source. Capacity is substantially larger than that of an EPPROM, making these chips a popular choice for digital cameras and desktop PCs.

There are two kinds of memory chips that are produced by the Company - BOC and FBGA.

BOARD ON CHIP(BOC)

BOC (Board on Chip) is the structure that connects bonding pad on substrate to the bonding pad of chip with memory
chip bonding side to the laminated substrate by using wire-bonding in the central slot. This board on chip ball grid
array packaging concept has been developed for memory devices to cater for high frequency application.


Use in Mobile devices, Desktop PC, Notebook PC, Workstation, Server, Video, Cameras, PDA, etc.

FINE PITCH BALL GRID ARRAY(FBGA)

FBGA (Fine pitch ball grid array) is a surface-mounted integrated circuit package widely deployed in
space-conscious applications, such as communication handsets, handheld computing devices, and
consumer electronics. FBGAs offer multiple benefits, such as low costs, small sizes and weights, high operating speeds, and medium power handling capabilities.


Use in Mobile devices, Desktop PC, Notebook PC, Workstation, Server, Video, Cameras, PDA, etc.